Updating the graphics
According to the actual process spec, there needs to be pad oxide and a layer of nitride as CMP end stop below the thick LTO. Updated the graphics accordingly
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- process_steps/process_hightech/tikz_process_steps/contact.a.tex 2 additions, 2 deletions...s_steps/process_hightech/tikz_process_steps/contact.a.tex
- process_steps/process_hightech/tikz_process_steps/metal1.tex 5 additions, 4 deletionsprocess_steps/process_hightech/tikz_process_steps/metal1.tex
- process_steps/process_hightech/tikz_process_steps/paint_functions.tex 24 additions, 2 deletions...s/process_hightech/tikz_process_steps/paint_functions.tex
- process_steps/process_hightech/tikz_process_steps/silicification.a.tex 4 additions, 0 deletions.../process_hightech/tikz_process_steps/silicification.a.tex
- process_steps/process_hightech/tikz_process_steps/silicification.metal_deposition.b.tex 1 addition, 25 deletions.../tikz_process_steps/silicification.metal_deposition.b.tex
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