diff --git a/process_steps/process_hightech/process_hightech_interconnect.tex b/process_steps/process_hightech/process_hightech_interconnect.tex
index 31ec03f5908089df3a82a38a1c76ed48b856f7f6..f138929043586fe11f38e2df0f08ff31f8ea6148 100644
--- a/process_steps/process_hightech/process_hightech_interconnect.tex
+++ b/process_steps/process_hightech/process_hightech_interconnect.tex
@@ -30,7 +30,7 @@ except that the glass layer is the top oxide opening and doesn't get any more me
 
 An example of the general flow can be seen in \autoref{chapter_silicide_and_cmp} where it already has been performed for the interface area between back end and front end process.
 
-We deposit 150nm LTO and etch holes into it, in order to contact through to the lower layer.
+We deposit 1\um LTO, CMP it and etch holes into it, in order to contact through to the lower layer.
 
 For the first metal layer (\autoref{chapter_metal1}), the etch stop is silicide and we have to sputter Nickel, as a diffusion barrier, before we sputter any Aluminum,
 because the $Ti Si_2$ would react with the Aluminum to an high resistivity material.
diff --git a/process_steps/process_hightech/process_hightech_silicification.tex b/process_steps/process_hightech/process_hightech_silicification.tex
index bf32ef505f4d58294dfaa1ba38e171a13f0343cf..b485113213fc1e1be1758beff8bbf1bd127f3ecc 100644
--- a/process_steps/process_hightech/process_hightech_silicification.tex
+++ b/process_steps/process_hightech/process_hightech_silicification.tex
@@ -135,6 +135,11 @@ The unreacted titanium film on the dielectric layer such as $SiO_2$ or $SiN$ is
 After 2-3 minutes in APM, at room temperature, with a bit mechanical help, all the unreacted Titanium should be gone and the oxide should become visible again.
 Under \textbf{no circumstance} use a solvent containing HF, since $Ti Si_2$ dissolves in HF or any other Fluoride containing solutions.
 
+Better cleaning results can be achieved by adding mechanical stress to the unreacted metal while having it inside the RCA-1 solution,
+so if you can put it into an ultrasonic bath, the RCA-1 cleaning results can be improved by this.
+
+\newpage
+
 \subsection{CMP}\label{chapter_silicide_and_cmp}
 
 After we formed all the active devices and added the silicide in order to reduce the sheet resistance of junctions and contacts we have to make sure that
diff --git a/process_steps/process_hightech/process_hightech_steps.pdf b/process_steps/process_hightech/process_hightech_steps.pdf
index 0a9aadc491cf01f9356121cf8a3924782814620b..1e83c95f0dde8f4a75442b1e8751da1d804587de 100644
Binary files a/process_steps/process_hightech/process_hightech_steps.pdf and b/process_steps/process_hightech/process_hightech_steps.pdf differ
diff --git a/process_steps/process_hightech/tikz_process_steps/contsts.tex b/process_steps/process_hightech/tikz_process_steps/contsts.tex
index 1336a432e67d3d9047e9f3e1674e1504a1c28987..761297f57f7164a6981d2ef396db181f329d4ca2 100644
--- a/process_steps/process_hightech/tikz_process_steps/contsts.tex
+++ b/process_steps/process_hightech/tikz_process_steps/contsts.tex
@@ -26,7 +26,7 @@
 \def\UpperMetalResist{9.0}
 \def\UpperMoreMetalResist{16.0}
 
-\def\CrossSectionOnly{0.2}
+\def\CrossSectionOnly{0.3}
 \def\CrossAndTopSection{0.2}
 \def\CrossAndTopSectionBig{0.3}
 
diff --git a/process_steps/process_hightech/tikz_process_steps/tripple_well.layout.tex b/process_steps/process_hightech/tikz_process_steps/tripple_well.layout.tex
index 618d7fd2924055e945da9f356112f27bae75c94f..a2f43c58d2dd20c4c9627a72a42e342b72e2e45d 100644
--- a/process_steps/process_hightech/tikz_process_steps/tripple_well.layout.tex
+++ b/process_steps/process_hightech/tikz_process_steps/tripple_well.layout.tex
@@ -14,9 +14,9 @@
 
 \fill[nwell,opacity=\OpacityLayout] (35.25,1.00) rectangle (42.25,7.25);
 
-\fill[pbase,opacity=\OpacityLayout] (35.50,2.0) rectangle (36.60,6.25);
+\fill[pbase,opacity=\OpacityLayout] (35.50,2.0) rectangle (36.60,5.00);
 \fill[pbase,opacity=\OpacityLayout] (35.50,5.0) rectangle (42.00,6.25);
-\fill[pbase,opacity=\OpacityLayout] (40.90,2.0) rectangle (42.00,6.25);
+\fill[pbase,opacity=\OpacityLayout] (40.90,2.0) rectangle (42.00,5.00);
 
 \fill[pbase,opacity=\OpacityLayout] (38.20,2.0) rectangle (39.30,4.00);